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Finite Element Analysis (FEA) of the Stress and Strain Distribution in Cone-Morse Implant-Abutment Connection Implants Placed Equicrestally and Subcrestally

Articolo
Data di Pubblicazione:
2023
Abstract:
Peri-implant bone resorption has been reported around some implants after loading, which could create problems for the peri-implant soft and hard tissues' long-term stability. The reasons for this are still not known. However, relevant importance could be given to this due to the presence of a bacterial contamination at the micro-gap level between implant and abutment. In this regard, external and internal implant-abutment assemblies have been shown to be much more permeable to bacterial colonization than Cone-Morse or conical connections. The placement of a subcrestal implant could have aesthetic advantages, therefore allowing a better prosthetic emergence profile. In literature, controversial experimental and clinical results have been reported on bone resorption around implants placed equicrestally and subcrestally. Interestingly, Finite Element Analysis (FEA) studies revealed to be extremely useful for assessing the peri-implant bone strain and stress. Thus, this study conducted a FEA evaluation of implants with a Cone-Morse implant-abutment assembly inserted into a bone block model mimicking equicrestal (0 mm) and subcrestal placements (-1 and -2 mm). Results demonstrated that maximum stresses were observed in the cortical bone around equicrestally placed implants, with the lowest in the 2 mm subcrestally placed implant and intermediate stresses within the 1 mm subcrestally placed implant. The cortical bone resulted more stressed under lateral loads than axial loads. In conclusion, this FEA study suggested a subcrestal implant placement ranging between -1 and -2 mm to obtain an adequate peri-implant stress pattern.
Tipologia CRIS:
1.1 Articolo in rivista
Keywords:
bacterial leakage; Cone-Morse connection; dental implants; equicrestal implant placement; finite element analysis (FEA); implant-abutment junction; implant placement; stress distribution; subcrestal implant placement
Elenco autori:
Di Pietro, N; Ceddia, M; Romasco, T; De Bortoli, N; Mello, Bf; Tumedei, M; Specchiulli, A; Piattelli, A; Trentadue, B
Autori di Ateneo:
DI PIETRO NATALIA
ROMASCO TEA
Link alla scheda completa:
https://ricerca.unich.it/handle/11564/814833
Link al Full Text:
https://ricerca.unich.it//retrieve/handle/11564/814833/396906/Di%20Pietro%20N%20&%20Ceddia%20applsci_2023.pdf
Pubblicato in:
APPLIED SCIENCES
Journal
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URL

https://www.mdpi.com/2076-3417/13/14/8147
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